教育背景：

2003.9 – 2007.7 天津大学 材料学院 材料成型及控制工程系 工学学士

2007.9 – 2012.1 天津大学 材料学院 材料加工工程系 工学博士.

工作经历：

2012.4 – 今 天津大学材料学院 讲师
2014.6 – 2015.1 美国弗吉尼亚理工大学材料科学与工程系 访问学者.

高温功率电子及光电子封装技术；封装材料与结构可靠性及失效分析.

主要承担项目：

[1]裸铜基大功率IGBT器件的无铅烧结型界面及其服役可靠性研究，国家自然科学基金，2015.1-2017.12
[2]新型热界面材料封装大功率LED的恶劣环境可靠性研究，天津市自然科学基金，2013.4-2016.3
[3]功率电子封装中新型热界面材料的高温扩散行为研究，教育部博士点基金，2014.1-2016.12
[4]高密度三维封装IGBT无铅化模块关键技术研究，天津大学自主创新基金，2016.1-2017.12
[5]功率电子封装中新型热界面材料的高温扩散行为研究，天津大学自主创新基金，2013.1-2014.12.

发表文章、专利、专著（代表作）：

[1]Su-Yan Zhao, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Effect of Silver Flakes in a Novel Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs chip/silver paste/bare Cu), Journal of Electronic Materials, 2016.
[2]Cheng-Xiang Yang, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Enhanced Pressureless Bonding by Tin Doped Silver Paste at Low Sintering Temperature, Materials Science & Engineering: A, 2016, 660: 71-76.
[3]Su-Yan Zhao, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Study on High Temperature Bonding Reliability of Sintered Nano-Silver Joint on Bare Copper Plate, Microelectronics Reliability, 2015, 55(12): 2524-2531.
[4]Ya-Fei Kong, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Effects of Die-Attach Material and Ambient Temperature on Properties of High-Power COB Blue LED Module, IEEE Transactions on Electron Devices, 2015, 62(7): 2251-2256.
[5]Yan-Song Tan, Xin Li*, Xu Chen, Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature, Microelectronics Reliability, 2014, 54(3): 648-653.
[6]Xin Li, Gang Chen, Lei Wang, et al, Creep properties of low-temperature sintered nano-silver lap shear joints, Materials Science and Engineering: A, 2013, 579: 108-113.
[7]Xin Li, Gang Chen, Lei Wang, et al, High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force, Microelectronics Reliability, 2013, 53 (1): 174-181.
[8]Xin Li, Gang Chen, Lei Wang, et al, Mechanical property evaluation of nano-silver paste sintered joint using lap-shear test, Soldering & Surface Mount Technology, 2012, 24 (2): 120-126.
[9]Xin Li, Xu Chen, Guo-Quan Lu, Reliability of high-power light emitting diode attached with different thermal interface materials, Journal of Electronic Packaging, 2010, 132 (3): 031011.
[10]Jia Chen, Xin Li*, Ya-Fei Kong, et at, Lifetime estimation of high-power LED module using die attach material of nano-silver paste, Chinese Journal of Luminescence, 2016.
[11]Cheng-Xiang Yang, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, High Power COB LED Modules Attached by Nano Silver Paste, Chinese Journal of Luminescence, 2016, 37(1): 94-99.
[12]Su-Yan Zhao, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Silver paste pressureless sintering on bare copper substrates for large area chip bonding in high power electronic packaging, Proceedings of 2015 International Conference on Electronic Packaging and iMAPS All-Asia Conference (ICEP-IAAC), 2015, 491-494.
[13]Xin Li*, Xu Chen, Guo-Quan Lu, Isothermal low cycle fatigue behavior of nano-silver sintered single lap shear joint, Proceedings of the 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2012, 1209-15.
[14]Xin Li, Xu Chen, Guo-Quan Lu, Effect of die-attach material on performance and reliability of high-power light-emitting diode modules, Proceedings IEEE 60th Electronic Components and Technology Conference (ECTC 2010), 2010, 1344-6.
[15]Xin Li, Xu Chen, Guo-Quan Lu, Study on adhesive reliability of low-temperature sintered high power LED modules, Proceedings of the 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010, 1371-76.