李海龙 副教授/工学博士

Email: dragoneptech@163.com

Email: hailongli@tju.edu.cn

研究所：焊接与先进制造技术研究所

教育背景：

·2011.09-2015.10 哈尔滨工业大学材料加工工程专业 工学博士

·2009.09-2011.07 哈尔滨工业大学材料加工工程专业 工学硕士

·2005.09-2009.07 哈尔滨工业大学焊接技术与工程专业 工学学士

工作经历：

·2025.07-至今 天津大学材料学院材料加工系 副教授

·2015.12-2025.06 天津大学材料学院材料加工系 讲师

·2018.10-2020.08 美国加州大学洛杉矶分校 国家公派博士后

研究方向

·研究领域：

电子封装技术、微纳连接技术、AI驱动智能化可靠性分析与测试技术、仿真与失效分析技术

·讲授课程：

本科生课程：《半导体器件物理》、《电子材料》、《快速成型技术》

研究生课程：《钎焊与微连接》

研究生招生

·导师团专项招生（材料学院）：

北京卫星制造厂-天津大学宇航先进电子封装团队

https://tj.teacher.360eol.com/teacherBasic/preview?teacherId=28862

·导师团专项招生（微电子学院）：

功率半导体器件封装及可靠性研究团队

https://tj.teacher.360eol.com/teacherBasic/preview?teacherId=28845

标志性成果

发表论文（通讯作者和第一作者）：

· Lin Qi, Weiling Xu, Ben Fan, Xingyu Pan, Xingke Zhang, Peipei Yu, Yafei Zhao, Xinchao Tan, Xiaomei Tian, Hailong Li. Research on the effect of 7K extreme low temperature storage on the electrical and mechanical properties of SAC305/SnPb mixed solder joints [J]. Journal of Materials Science: Materials in Electronics, 2025, 36(4): 261.

· Xingyu Pan, Sheng Zhao, Lin Qi, Xiaobin He, Jing Wan, Hailong Li. Random vibration lifetime prediction model based on overshoot correction for metal hermetic sealing structure considering transient response [J]. Journal of Materials Science: Materials in Electronics, 2025, 36(3): 193.

·李海龙, 潘星雨, 刘青, 李晓光, 刘佳涛, 崔雷. GH4065A高温合金惯性摩擦焊接本构模型及热变形行为研究 [J]. 精密成形工程, 2024, 16(10): 1-9.

· Weijing Gong, Bin Li, Fangqin She, Lixian Guo, Hailong Li, Na Lu. Diffusion-driven height readout analytical device based on gold nanobipyramid-doped supramolecular hydrogel for point-of-care bioanalysis [J]. Sensors and Actuators B: Chemical, 2024, 418: 136330.

· Bin Li, Heng Liu, Xianrong Xing, Caixia Zeng, Min Zhang, Hailong Li, Na Lu. Carbon-Decorated Fe3O4 Nanocomposites as Enhanced Enzyme Mimics for Colorimetric Determination of H2O2 and Glucose [J]. ACS Applied Nano Materials, 2024, 7(17): 20985-20993.

· Tao Wang, Long Li, Dong Wang, Ping Wu, De Cao, Zhen Chen, Hailong Li. Investigation into the strength of β-Sn/α-CoSn3 and Co/α-CoSn3 interfaces with Ni-doped α-CoSn3 using first-principles calculations [J]. Computational Materials Science, 2024, 245: 113310.

· Jianghao Yu, Xiaobin He, Xingyu Pan, Shiguang Hao,Hailong Li. Practical method for studying the dispersion behavior of TiC nanoparticles in molten Mg [J]. Computational Materials Science, 2024, 238: 112927.

· Lin Qi, Weiling Xu, Jianghao Yu, Qiang Liu, Danfeng Xie, Yanwei Wu, Ruidong Yang, Jingzhao Zhang, Hefeng Zhang,Hailong Li. Reliability analysis of random vibration for a CCGA624 component based on an improved Miner’s rule [J]. Journal of Materials Science: Materials in Electronics, 2023, 34(36): 2318.

· Shiguang Hao,Hailong Li. Effect of twin grain boundary on the diffusion of Cu in bulk β-Sn [J]. Computational Materials Science, 2023, 226: 112200.

· Xuehong Zhang,Hailong Li, Tao Wang, Shiguang Hao. A case study of dispersion behaviors of TiC nanoparticles in molten Al [J]. Chemical Physics, 2022, 554: 111405.

· Tao Wang,Hailong Li, Xuehong Zhang, Xin Li. First-principles calculations on physical properties of α-CoSn3 intermetallic compound and β-Sn/α-CoSn3 interface [J]. Journal of Electronic Materials, 2021, 50(5): 2813-2821.

· Tao Wang,Hailong Li, Shiguang Hao, Xuehong Zhang. Effect of Ni on the Au embrittlement in Sn/Au/Ni solder bump [J]. Journal of Materials Science: Materials in Electronics, 2021, 32(24): 28426-28435.

· Yutao Lin,Hailong Li, Gang Chen. Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints [J]. Journal of Materials Science: Materials in Electronics, 2020, 31(14): 11569-11580.

· Yiming Jiang,Hailong Li, Gang Chen, Yunhui Mei, Meiyu Wang. Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints [J]. Journal of Materials Science: Materials in Electronics, 2019, 30(6): 6224-6233.

· Hailong Li, Rong An, Chunqing Wang, Bin Li. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing [J]. Materials Letters, 2015, 158(0): 252-254.

· Hailong Li, Rong An, Chunqing Wang, Zhi Jiang. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging [J]. Journal of Alloys and Compounds, 2015, 634(0): 94-98.

· Hailong Li, Rong An, Chunqing Wang, Yanhong Tian, Zhi Jiang. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints [J]. Materials Letters, 2015, 144(0): 97-99.