Li Xin

Research direction

High Power Module Integration, Packaging Reliability and Failure Analysis

Education

2009.3-2012.1  Ph. D in Materials Processing Engineering, Tianjin University
2007.9-2009.1  M.S. in Materials Processing Engineering, Tianjin University
2003.9-2007.6  B.S. in Material Forming and Control Engineering, Tianjin University

Employment history

2012.4-present Teacher in School of Materials Science and Engineering, Tianjin University
2014.6-2015.1 Visiting Scholar in Departmant of Materials Science, Virginia Tech

Areas of research interest

High Power Module Integration, Packaging Reliability and Failure Analysis

Research projects

2015.1-2017.12 In charge of the National Natural Science Foundation of China, "Study on the Service Reliability of the Bare Copper Based Sintered Interface in High Power IGBT Devices"
2013.4.1-2016.3.31 In charge of the Natural Science Fund of Tianjin, China, "Study on Reliability of High Power LEDs Packaged with Novel Thermal Interfacial Material under Execrable Condition"
2014.1-2016.12 In charge of the Ph. D. Programs Foundation of Ministry of Education of China, "High Temperature Diffusion Behavior of the Novel Thermal Interface Material Used in Power Electronic Packaging"
2016.1-2017.12 In charge of Independent Innovation Foundation of Tianjin University, "Study on the 3D High Density Packaging of IGBT Lead-Free Module"
2013.1-2014.12 In charge of Independent Innovation Foundation of Tianjin University, "High Temperature Diffusion Behavior of the Novel Thermal Interface Material Used in Power Electronic Packaging"

Selected publications (Journal articles, patents and books)

[1] Su-Yan Zhao, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Effect of Silver Flakes in a Novel Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs chip/silver paste/bare Cu), Journal of Electronic Materials, 2016.
[2] Cheng-Xiang Yang, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Enhanced Pressureless Bonding by Tin Doped Silver Paste at Low Sintering Temperature, Materials Science & Engineering: A, 2016, 660: 71-76.
[3] Su-Yan Zhao, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Study on High Temperature Bonding Reliability of Sintered Nano-Silver Joint on Bare Copper Plate, Microelectronics Reliability, 2015, 55(12): 2524-2531.
[4] Ya-Fei Kong, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Effects of Die-Attach Material and Ambient Temperature on Properties of High-Power COB Blue LED Module, IEEE Transactions on Electron Devices, 2015, 62(7): 2251-2256.
[5] Yan-Song Tan, Xin Li*, Xu Chen, Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature, Microelectronics Reliability, 2014, 54(3): 648-653.
[6] Xin Li, Gang Chen, Lei Wang, et al, Creep properties of low-temperature sintered nano-silver lap shear joints, Materials Science and Engineering: A, 2013, 579: 108-113.
[7] Xin Li, Gang Chen, Lei Wang, et al, High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force, Microelectronics Reliability, 2013, 53 (1): 174-181.
[8] Xin Li, Gang Chen, Lei Wang, et al, Mechanical property evaluation of nano-silver paste sintered joint using lap-shear test, Soldering & Surface Mount Technology, 2012, 24 (2): 120-126.
[9] Xin Li, Xu Chen, Guo-Quan Lu, Reliability of high-power light emitting diode attached with different thermal interface materials, Journal of Electronic Packaging, 2010, 132 (3): 031011.
[10] Jia Chen, Xin Li*, Ya-Fei Kong, et at, Lifetime estimation of high-power LED module using die attach material of nano-silver paste, Chinese Journal of Luminescence, 2016.
[11] Cheng-Xiang Yang, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, High Power COB LED Modules Attached by Nano Silver Paste, Chinese Journal of Luminescence, 2016, 37(1): 94-99.
12] Su-Yan Zhao, Xin Li*, Yun-Hui Mei, Guo-Quan Lu, Silver paste pressureless sintering on bare copper substrates for large area chip bonding in high power electronic packaging, Proceedings of 2015 International Conference on Electronic Packaging and iMAPS All-Asia Conference (ICEP-IAAC), 2015, 491-494.
[13] Xin Li*, Xu Chen, Guo-Quan Lu, Isothermal low cycle fatigue behavior of nano-silver sintered single lap shear joint, Proceedings of the 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2012, 1209-15.
[14] Xin Li, Xu Chen, Guo-Quan Lu, Effect of die-attach material on performance and reliability of high-power light-emitting diode modules, Proceedings IEEE 60th Electronic Components and Technology Conference (ECTC 2010), 2010, 1344-6. 
[15] Xin Li, Xu Chen, Guo-Quan Lu, Study on adhesive reliability of low-temperature sintered high power LED modules, Proceedings of the 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010, 1371-76.