H.Y. Jing, H.J. Guo, L.X. Wang, J. Wei, L.Y. Xu, Influence of Ag-modified graphene nanosheets addition into Sn–Ag–Cu solders on the formation and growth of intermetallic compound layers，Journal of Alloys and Compounds, 2017, In press, DOI: 10.1016/j.jallcom.2017.01.286
 L.Y. Xu，J. Zhu, H.Y. Jing, L. Zhao, X.Q, Lv, Y.D. Han*, Effects of deep cryogenic treatment on residual stress and mechanical properties of electron beam-welded Ti–6Al–4V joint, Materials Science & Engineering A, Vol. 673 2016, 503-510.
 L.Y. Xu, X. Chen, L.X. Wang, H.Y. Jing, J. Wei, Y.D. Han*, Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders, Materials Science & Engineering A, Vol. 667, 2016, 87-96.
 L.Y. Xu, L.X. Wang, H.Y. Jing, J. Wei, Y.D. Han*, Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints, Journal of Alloys and Compounds, Vol. 650, 2015, 475-481.
L.Y. Xu, Y.F. Wang, H.Y. Jing, Y.D. Han*, Fatigue Strength Improvement of Stainless Steel Using Weld Toes Dressing with Low Transformation Temperature Welding Wire, Science and Technology of Welding and Joining, Vol. 19, No. 8, 2014, 664-672.
L.Y. Xu, G.Y. Yang, H.Y. Jing, J. Wei, Y.D. Han*, Ag-Graphene Hybrid Conductive Ink for Writing Electronics, Nanotechnology, Vol. 25, 2014, 055201.
 L.Y. Xu, G.Y. Yang, H.Y. Jing, J. Wei, Y.D. Han*, Pressure-assisted low-temperature sintering for paper-based writing electronics, Nanotechnology, Vol. 24, 2013, 355204.
 X.D. Liu, Y.D. Han, H.Y. Jing, J. Wei, L.Y. Xu*, Effect of Graphene Nanosheets Reinforcement on the Performance of Sn-Ag-Cu Lead-Free Solder, Materials Science & Engineering A, Vol. 562, 2013, 25-32.
 Y.D. Han*, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Interfacial Reaction and Shear Strength of Ni-Coated Carbon Nanotubes Reinforced Sn-Ag-Cu Solder Joints during Thermal Cycling, Intermetallics, Vol. 31, 2012, 72-78
 Y.D. Han, H.Y. Jing, L.Y. Xu*, Welding heat input effect on the hydrogen permeation in the X80 steel welded joints. Materials Chemistry and Physics, Vol. 132, 2012, 216-222.
 Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder. Journal of Electronic Materials, Vol. 39(2), 2010, 223-229.