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韩永典 副教授

材料科学及加工自动化系

电话: 022-85356740

Email: hanyongdian@tju.edu.cn

研究所: 焊接与先进制造技术研究所

个人简历

教育背景:

2001.07-2005.07 辽宁石油化工大学 金属材料工程专业 工学学士
2005.09-2007.03 天津大学 材料加工工程专业 工学硕士
2007.03-2010.03 天津大学 材料加工工程专业 工学博士

其中:2007.10-2009.10 新加坡南洋理工大学 联合培养博士研究生

工作经历:

2010.09-2014.06 天津大学材料科学与工程学院 讲师
2014.07-至今   天津大学材料科学与工程学院 副教授


学术兼职


中国焊接学会焊接力学及结构设计与制造专委会委员

中国焊接学会青年工作委员会委员

 

主要荣誉


天津大学北洋青年骨干教师(2013年)

 

研究方向

  面向微电子器件、深海油气管线中在高温、低温、疲劳、腐蚀等极端复杂环境下工作的焊接/连接结构,长期从事结构高性能焊接/连接制造、增材制造及结构完整性评估等方面的研究工作,具体方向如下:


1)微连接结构界面连接材料设计、高性能连接技术及寿命评估

针对微电子及柔性电子器件,研发高性能无铅钎料、金属纳米导电墨水,开发界面改性、低温(室温)烧结等高性能连接技术,研究微连接结构界面行为及在蠕变、疲劳、弯折塑性变形及复合条件下接头的变形、损伤本构模型与寿命预测模型,建立寿命评估方法,为相关微连接结构提供界面设计、连接、评价与评估;


2)深海油气管线焊接结构高性能长寿命焊接制造

针对深海油气管线,研究管线及其焊接接头的CO2腐蚀、氢致开裂、硫化氢应力腐蚀、晶间腐蚀及大变形下屈曲等失效机理,从焊接设计阶段提出防治措施,据此形成针对S型铺设、深水J-lay铺设、Reel-lay铺设的管道抗腐蚀、抗大变形的高效自动化焊接技术,为我国南海深海油气开发提供技术保障;


3)增材制造

基于激光选区熔化、激光熔覆等方法开展新型高熵合金、不锈钢及结构件的增材制造原理与技术研究,为航空、航天、海洋工程等领域提供3D打印高价值部件。

 

承担项目

主要承担项目:

[1] 天津市自然科学基金项目 16JCYBJC17300,纳米银颗粒/银线导电墨水室温烧结机理及可靠性研究,20164-20193月,10万,主持, 在研;
[2]
国家自然科学基金青年基金51205282,高密度电子封装中金属纳米粒子修饰石墨烯/Sn-Ag-Cu 钎料的设计及可靠性研究,20131-201512月,25万,主持, 完成;

[3] 国家海洋战略性新兴产业专项,BHSF2017-22,海洋高端装备焊接智能制造产业链协同创新和构建,201701-201912月,2005万元,项目骨干,在研;

[4] XX项目,XX激光增材制造,201707-201812月,50万元,项目骨干,在研;

[5] 国家海洋局海洋经济创新示范项目CXSF2014-12,海底管道焊接综合试验平台,20147-20176月,1726万,项目骨干, 完成;
[6]
天津市海洋局科技兴海项目KJXH2012-08,卷管式铺管管道高效焊接技术与大型弯管模拟装置开发,20126-20166月,340万,项目骨干,完成
[7] 863
子课题2011AA090302,水下摩擦叠焊原理样机研制及工艺研究,800万,201210-20166月,参加, 完成;

[8] 主持中海油、国家电网等央企横向技术开发与服务等科研项目20余项,累计科研经费1300余万元。

 

标志性成果

发表文章、专利、专著(代表作):

近年来发表SCI论文60余篇(第一/通讯作者SCI论文30篇),SCI他引400余次。

2018

[1] Y.D. Han, S.M. Zhang, H.Y. Jing, J. Wei, L. Zhao X.Q. Lv, L.Y. Xu, Ag nanoparticles - based hybrid ink with low metallization temperature. Nanotechnology, Vol. 29, 2018, 135301

[2] L.Y. Xu, H.Y. Jing, Y.D. Han*, Effect of Welding on the Corrosion behavior of X65/Inconel 625 in simulated solution, Welding in the world, Vol. 62, No. 2, 2018, 363-375

[3] L.Y. Xu, S.T. Zhang, L.X. Wang, H.Y. Jing, J. Wei, Y.D. Han*, Indentation size effect on Ag nanoparticle-modified graphene/Sn-Ag-Cu solders. Journal of Electronic Materials, Vol. 47, No. 1, 2018, 612-619

2017

[1] H.Y. Jing, H.J. Guo, L.X. Wang, J. Wei, L.Y. Xu, Y.D. Han*, Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layersJournal of Alloys and Compounds, Vol. 702, 2017, 669-678

[2] Lianyong Xu, Keke Ge, Hongyang Jing, Lei Zhao, Xiaoqing Lv, Yongdian Han*, Prediction of residual stresses in electron beam welded Ti-6Al-4V plates, Materials Testing, Vol. 59, No. 4, 2017, 323-329

2016

[1] L.Y. XuJ. Zhu, H.Y. Jing, L. Zhao, X.Q, Lv, Y.D. Han*, Effects of deep cryogenic treatment on residual stress and mechanical properties of electron beam-welded Ti–6Al–4V joint, Materials Science & Engineering A, Vol. 673 2016, 503-510

[2] L.Y. Xu, X. Chen, L.X. Wang, H.Y. Jing, J. Wei, Y.D. Han*, Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders, Materials Science & Engineering A, Vol. 667, 2016, 87-96

2015

[1] L.Y. Xu, L.X. Wang, H.Y. Jing, J. Wei, Y.D. Han*, Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints, Journal of Alloys and Compounds, Vol. 650, 2015, 475-481.

[2] L.Y. Xu, Z.K. Zhang, H.Y. Jing, J. Wei, Y.D. Han*, Effect of graphene nanosheets on the corrosion behavior of Sn–Ag–Cu solders, Journal of Materials Science: Materials in Electronics, Vol. 26, No. 8, 2015,5625-5634

2014

[1] Lianyong Xu, Hailun Zhao, Hongyang Jing, Yongdian Han*, Finite Element Analysis of Calibration Coefficients for Residual Stress Measurements by the Ring-Core Procedure, Materials Testing, Vol. 56, No. 11-12, 2014, 923-928

[2]L.Y. Xu, Y.F. Wang, H.Y. Jing, Y.D. Han*, Fatigue Strength Improvement of Stainless Steel Using Weld Toes Dressing with Low Transformation Temperature Welding Wire, Science and Technology of Welding and Joining, Vol. 19, No. 8, 2014, 664-672

[3] L.Y. Xu, G.Y. Yang, H.Y. Jing, J. Wei, Y.D. Han*, Ag-Graphene Hybrid Conductive Ink for Writing Electronics, Nanotechnology, Vol. 25, 2014, 055201

[4] L.Y. Xu, Y. Miao, H.Y. Jing, Y.D. Han*, Y.J. Jiang, X.H. Tian, J.A. Gao, Experimental and Numerical Investigation of Heated Band Width for Local Post Weld Heat Treatment of ASME P92 steel Pipe, Journal of Pressure Vessel Technology, Vol. 136, 2014, No. 1,011401

 2013

[1] Y.D. Han, L. Chen, H.Y. Jing, S.M.L. Nai, J. Wei, L.Y. Xu*, Effect of Ni-coated carbon nanotubes on the corrosion behavior of Sn-Ag-Cu solders, Journal of Electronic Materials, Vol. 42, No. 12, 2013, 3559-3566

[2] L.Y. Xu, G.Y. Yang, H.Y. Jing, J. Wei, Y.D. Han*, Pressure-assisted low-temperature sintering for paper-based writing electronics, Nanotechnology, Vol. 24, 2013, 355204

[3] F. Xue, L.Y. Xu, H.Y. Jing, Y.D. Han*, Corrosion Behavior of Mechanical Clad Pipe Welded Joints in CO2-Saturated Seawater under High Temperature and High Pressure, Materials and Corrosion, Vol. 64, No. 6, 2013, 544-549

[4] L.Y. Xu, P. Zhu, H.Y. Jing, K. Guo, S.X. Zhong, Y.D. Han*, Failure analysis of Incoloy 800HT pipe at high temperature, Engineering Failure Analysis, Vol. 31, 2013, 375-386

[5] L.Y. Xu, M. Li, H.Y. Jing, Y.D. Han*, Electrochemical Behavior of Corrosion Resistance of X65/Inconel 625 Welded Joints, International Journal of Electrochemical Science, 2013, Vol. 8, 2069-2079

[6]X.D. Liu, Y.D. Han, H.Y. Jing, J. Wei, L.Y. Xu*, Effect of Graphene Nanosheets Reinforcement on the Performance of Sn-Ag-Cu Lead-Free Solder, Materials Science & Engineering A, Vol. 562, 2013, 25-32

2012

[1] Y.D. Han*, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Interfacial Reaction and Shear Strength of Ni-Coated Carbon Nanotubes Reinforced Sn-Ag-Cu Solder Joints during Thermal Cycling, Intermetallics, Vol. 31, 2012, 72-78 (SCI:028BY, 他引3).

[2] Y.D. Han*, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Effect of Ni coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints, Journal of Electronic Materials, Vol. 41, No. 9, 2012, 2478-2486

[3] Y.D. Han*, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Creep mitigation in Sn-Ag-Cu composite solder with Ni coated carbon nanotubes. Journal of Materials Science: Materials in Electronics, Vol. 23(5), 2012, 1108-1115

[4] Y.D. Han, H.Y. Jing, L.Y. Xu*, Welding heat input effect on the hydrogen permeation in the X80 steel welded joints. Materials Chemistry and Physics, Vol. 132, 2012, 216-222

2011

[1] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Development of Ni coated carbon nanotubes-reinforced Sn-Ag-Cu solder, Journal of Materials Science: Materials in Electronics, Vol. 22(3), 2011, 315-322

2010

[1] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Indentation size effect on the creep behavior of a Sn-Ag-Cu lead free solder. International Journal of Modern Physics B, Vol. 24(1-2), 2010, 267-275

[2] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder. Journal of Electronic Materials, Vol. 39(2), 2010, 223-229

2009

[1] Y.D. Han, H.Y. Jing, S.M.L. Nai, C.M. Tan, J. Wei*, et al. A new constitutive model for creep of Sn-Ag-Cu solder joints. Journal of Physics D: Applied Physics, Vol. 42, 2009, 125411

 


科技奖励:


[1] 2017年获天津市科技进步一等奖,深海油气管道全寿命评估与焊接制造关键技术开发及应用、排名第3

[2] 2012年获天津市科技进步一等奖,超()临界机组关键高温设备完整性与寿命评估技术及应用、排名第2

[3] 2010年获教育部科技进步一等奖,基于局部法的大型焊接结构完整性评定技术与应用、排名第5